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Commit 82c02f58 ("usb: musb: Allow multiple glue layers to be built in") enabled selecting multiple glue layers, which in turn exposed things more for randconfig builds. If NOP_USB_XCEIV is built-in and TUSB6010 is a loadable module, we will get: drivers/built-in.o: In function `tusb_remove': tusb6010.c:(.text+0x16a817): undefined reference to `usb_phy_generic_unregister' drivers/built-in.o: In function `tusb_probe': tusb6010.c:(.text+0x16b24e): undefined reference to `usb_phy_generic_register' make: *** [vmlinux] Error 1 Let's fix this the same way as commit 70c1ff4b ("usb: musb: tusb-dma can't be built-in if tusb is not"). And while at it, let's not allow selecting the glue layers except on platforms really using them unless COMPILE_TEST is specified: - TUSB6010 is in practise only used on omaps - DSPS is only used on TI platforms - UX500 is only used on STE platforms Cc: Linus Walleij <linus.walleij@linaro.org> Reported-by:Jim Davis <jim.epost@gmail.com> Signed-off-by:
Tony Lindgren <tony@atomide.com> Signed-off-by:
Felipe Balbi <balbi@ti.com>
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