Commit 724adec3 authored by Zhang Rui's avatar Zhang Rui Committed by Thomas Gleixner
Browse files

thermal/x86_pkg_temp_thermal: Support multi-die/package 



Package temperature sensors are actually implemented in hardware per-die.
Thus, the new multi-die/package systems sport mulitple package thermal
zones for each package.

Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can expose
multiple zones per package, instead of just one.

Signed-off-by: default avatarZhang Rui <rui.zhang@intel.com>
Signed-off-by: default avatarLen Brown <len.brown@intel.com>
Signed-off-by: default avatarThomas Gleixner <tglx@linutronix.de>
Reviewed-by: default avatarIngo Molnar <mingo@kernel.org>
Acked-by: default avatarPeter Zijlstra (Intel) <peterz@infradead.org>
Link: https://lkml.kernel.org/r/281695c854d38d3bdec803480c3049c36198ca44.1557769318.git.len.brown@intel.com
parent 32fb480e

drivers/thermal/intel/x86_pkg_temp_thermal.c

+4 −4
Original line number Diff line number Diff line
@@ -122,7 +122,7 @@ err_out: 
 */

static struct pkg_device *pkg_temp_thermal_get_dev(unsigned int cpu)

{

	int pkgid = topology_logical_package_id(cpu);

	int pkgid = topology_logical_die_id(cpu);



	if (pkgid >= 0 && pkgid < max_packages)

		return packages[pkgid];
@@ -353,7 +353,7 @@ static int pkg_thermal_notify(u64 msr_val) 


static int pkg_temp_thermal_device_add(unsigned int cpu)

{

	int pkgid = topology_logical_package_id(cpu);

	int pkgid = topology_logical_die_id(cpu);

	u32 tj_max, eax, ebx, ecx, edx;

	struct pkg_device *pkgdev;

	int thres_count, err;
@@ -449,7 +449,7 @@ static int pkg_thermal_cpu_offline(unsigned int cpu) 
	 * worker will see the package anymore.

	 */

	if (lastcpu) {

		packages[topology_logical_package_id(cpu)] = NULL;

		packages[topology_logical_die_id(cpu)] = NULL;

		/* After this point nothing touches the MSR anymore. */

		wrmsr(MSR_IA32_PACKAGE_THERM_INTERRUPT,

		      pkgdev->msr_pkg_therm_low, pkgdev->msr_pkg_therm_high);
@@ -515,7 +515,7 @@ static int __init pkg_temp_thermal_init(void) 
	if (!x86_match_cpu(pkg_temp_thermal_ids))

		return -ENODEV;



	max_packages = topology_max_packages();

	max_packages = topology_max_packages() * topology_max_die_per_package();

	packages = kcalloc(max_packages, sizeof(struct pkg_device *),

			   GFP_KERNEL);

	if (!packages)

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