+13
−0
+50
−58
+82
−116
+208
−6
drivers/usb/dwc3/dwc3-exynos.c
0 → 100644
+151
−0
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usb: dwc3: changes for v3.4 merge window Here are the changes for v3.4 merge window. It includes a new glue layer for Samsung's Exynos platform, a simplification of memory management on DWC3 driver by using dev_xxx functions, a few optimizations to IRQ handling by dropping memcpy() and using bitshifts, a fix for TI's OMAP5430 TX Fifo Allocation, two fixes on USB2 test mode implementation (one on debugfs and one on ep0), and several minor changes such as whitespace cleanups, simplification of a few parts of the code, decreasing a long delay to something a bit saner, dropping a header which was included twice and so on. The highlight on this merge is the support for Samsung's Exynos platform, increasing the number of different users for this driver to three. Note that Samsung Exynos glue layer will only compile on platforms which provide implementation for the clk API for now. Once Samsung supports pm_runtime, that limitation can be dropped from the Makefile. Conflicts: drivers/usb/dwc3/gadget.c
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