Commit 23affa2e authored by Daniel Lezcano's avatar Daniel Lezcano
Browse files

thermal/drivers/cpu_cooling: Rename to cpufreq_cooling



As we introduced the idle injection cooling device called
cpuidle_cooling, let's be consistent and rename the cpu_cooling to
cpufreq_cooling as this one mitigates with OPPs changes.

Signed-off-by: default avatarDaniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: default avatarViresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: default avatarAmit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20191219225317.17158-3-daniel.lezcano@linaro.org
parent a4c428e5
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@@ -67,7 +67,7 @@ TMU driver description:
The exynos thermal driver is structured as::

					Kernel Core thermal framework
				(thermal_core.c, step_wise.c, cpu_cooling.c)
				(thermal_core.c, step_wise.c, cpufreq_cooling.c)
								^
								|
								|
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@@ -16349,7 +16349,7 @@ L: linux-pm@vger.kernel.org
S:	Supported
F:	Documentation/driver-api/thermal/cpu-cooling-api.rst
F:	Documentation/driver-api/thermal/cpu-idle-cooling.rst
F:	drivers/thermal/cpu_cooling.c
F:	drivers/thermal/cpufreq_cooling.c
F:	drivers/thermal/cpuidle_cooling.c
F:	include/linux/cpu_cooling.h
+1 −1
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@@ -19,7 +19,7 @@ thermal_sys-$(CONFIG_THERMAL_GOV_USER_SPACE) += user_space.o
thermal_sys-$(CONFIG_THERMAL_GOV_POWER_ALLOCATOR)	+= power_allocator.o

# cpufreq cooling
thermal_sys-$(CONFIG_CPU_FREQ_THERMAL)	+= cpu_cooling.o
thermal_sys-$(CONFIG_CPU_FREQ_THERMAL)	+= cpufreq_cooling.o
thermal_sys-$(CONFIG_CPU_IDLE_THERMAL)	+= cpuidle_cooling.o

# clock cooling
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@@ -7,7 +7,7 @@
 *  Copyright (C) 2013	Texas Instruments Inc.
 *  Contact:  Eduardo Valentin <eduardo.valentin@ti.com>
 *
 *  Highly based on cpu_cooling.c.
 *  Highly based on cpufreq_cooling.c.
 *  Copyright (C) 2012	Samsung Electronics Co., Ltd(http://www.samsung.com)
 *  Copyright (C) 2012  Amit Daniel <amit.kachhap@linaro.org>
 */
+3 −3
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// SPDX-License-Identifier: GPL-2.0
/*
 *  linux/drivers/thermal/cpu_cooling.c
 *  linux/drivers/thermal/cpufreq_cooling.c
 *
 *  Copyright (C) 2012	Samsung Electronics Co., Ltd(http://www.samsung.com)
 *
@@ -621,7 +621,7 @@ of_cpufreq_cooling_register(struct cpufreq_policy *policy)
	struct thermal_cooling_device *cdev = NULL;

	if (!np) {
		pr_err("cpu_cooling: OF node not available for cpu%d\n",
		pr_err("cpufreq_cooling: OF node not available for cpu%d\n",
		       policy->cpu);
		return NULL;
	}
@@ -631,7 +631,7 @@ of_cpufreq_cooling_register(struct cpufreq_policy *policy)

		cdev = __cpufreq_cooling_register(np, policy, em);
		if (IS_ERR(cdev)) {
			pr_err("cpu_cooling: cpu%d failed to register as cooling device: %ld\n",
			pr_err("cpufreq_cooling: cpu%d failed to register as cooling device: %ld\n",
			       policy->cpu, PTR_ERR(cdev));
			cdev = NULL;
		}
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