课程大纲
COURSE SYLLABUS
1.
课程代码/名称
Course Code/Title
电子薄膜与器件简介
Introduction to electronic thin films and devices
2.
课程性质
Compulsory/Elective
专业选修
Major Elective Course
3.
开课单位
Offering Dept.
深港微电子学院
School of Microelectronics
4.
课程学分/学时
Course Credit/Hours
4
学分
/64
学时
4 Credit/64 Hours
5.
授课语言
Teaching Language
Chinese
6.
授课教师
Instructor(s)
陈鹏
Peng Chen
7.
开课学期
Semester
秋季
Fall
8.
是否面向本科生开放
Open to undergraduates
or not
No
9.
先修要求
Pre-requisites
(如面向本科生开放,请注明区分内容。
If the course is open to
undergraduates, please indicate the difference.
半导体材料物理
10.
教学目标
Course Objectives
(如面向本科生开放,请注明区分内容。
If the course is open to undergraduates, please indicate the
difference.
介绍电子薄膜相关的基本知识:了解电子薄膜制备、表征技术;了解电子薄膜材料在微电子器件等领
域的应用。
To introduce the basic knowledge of electronic thin films: the fabrication and characterization
of electronic
thin films; the applications of thin films in microelectronic devices, etc.
11.
教学方法
Teaching Methods
(如面向本科生开放,请注明区分内容。 If the course is open to undergraduates, please ind
icate the
difference.
理论教学
Theoretical teaching
12.
教学内容
Course Contents
(如面向本科生开放,请注明区分内容。 If the course is open to undergraduates, please indicate the
difference.
Section 1
电子薄膜简介
6
学时)
Introduction of electronic thin films 6 hours
Section 2
/
电子束蒸镀技术
(6 hours)
Thermal/electron beam evaporation (6 hours)
Section 3
磁控溅射技术
3 hours
Magnetron sputtering (3 hours)
Section 4
CVD
化学气相沉积技术
6 hours
Chemical vapor deposition (6 hours)
Section 5
PLD
脉冲激光沉积技术
6 hours
Pulsed laser deposition (6 hours)
Section 6
ALD
原子层沉积技术
6 hours
Atomic layer deposition (6 hours)
Section 7
MBE
分子束外延技术
6 hours
Molecular Beam epitaxy (6 hours)
Section 8
电子薄膜表征技术
6 hours
Electronic thin film characterization (6 hours)
Section 9
电子薄膜的基本电学性质
6 hours
Basic electronic properties of electronic thin films 6 hours
Section 10
电子薄膜在微电子器件中的应用
13 hours
Applications of electronic thin films in the microelectronic devices (13 hours)
13.
课程考核
Course Assessment
1 考核形式 Form of examination
2 .分数构成 grading policy
3 如面向本科生开放,请注明区分内容。
If the course is open to undergraduates, please indicate the difference.
考核方式:考查
Form of examination: examine
出勤(10%) + 课堂表现 (30%) + 期末报告 (40%)
Attendance (10%) + Class Performance (30%) + Final Presentation (40%)
14.
教材及其它参考资料
Textbook and Supplementary Readings
教材
Textbooks:
1.The Material Science of Thin Films, Milton Ohring, Academic Press, 2002.
参考书籍 Reference books:
1.电子薄膜科学, 杜经宁, 科学学出版社, 1997.
2.Thin Film Device Applications, Chopra, K L; Kaur, I, Springer, 2012.