课程大纲

COURSE SYLLABUS

课程代码/名称

Course Code/Title

半导体芯片封装测试与可靠性

Semiconductor IC assembly, test, and reliability

课程性质

Compulsory/Elective

专业选修课

Major Elective Courses

课程学分/学时

Course Credit/Hours

2/48

授课语言

Teaching Language

英

中

English & Chinese

授课教师

Instructor(s)

郭跃进 Yuejin Guo

先修要求

Pre-requisites

半导体器件

Semiconductor device

教学目标

Course Objectives

集成电路产业由芯片设计、晶圆制造，和封装测试三部分组成，本课程旨在通过让学生学习和了解

芯片的封装测试与可靠性，使学生认识到封装在集成电路产业中起着越来越重要的作用。内容包括

集成电路芯片封装概述、封装工艺流程、陶瓷封装、塑料封装、气密性封装、封装可靠性工程、封

装过程中的缺陷分析和先进封装技术。通过该课程，学生能较容易地认识封装行业，理解封装技术

和工艺流程，了解先进的封装技术。培养学生将掌握封装的基本原理，学会并培养分析解决封装技

术能力，为今后从事人集成电路芯片科研及开发工作打下良好的专业基础。

Integrated circuit industry consists of three parts: chip design, wafer manufacturing, and package testing,

this course aims to enable studen

ts to learn and understand the packaging testing and reliability of chips, so

that students realize that packaging plays an increasingly important role in the integrated circuit industry.

The content includes IC chip package overview, packaging process, ce

ramic packaging, plastic packaging,

hermetic packaging, packaging reliability Engineering, defect analysis in the packaging process and

advanced packaging technology. Through this course, students can easily understand the packaging

industry, understanding

packaging technology and process flow, and understanding advanced packaging

technology. Learn the ability of analysis and solution of packaging technology.

教学方法

Teaching Methods

讲授

Lectures,

习题

辅导

讨论

Tutorials,

实验

实习

Lab/Practical

教学内容

Course Contents

Section 1

课程介绍，芯片封装和测试

Introduction of assembly, test, and reliability。

Section 2

引线键合和倒装芯片封装技术

Wire bonding and flip chip packaging technology

Section 3-4

扇出和晶圆级封装

, 2.5D

和

封装，

和

SiP

等先进封装

Fanout and csp packaging，2.5D and 3D packaging, and

SiP advanced

packaging

Section 5

GaN

和

SiC

第三代半导体的大功率电力器件和

功放器件的封装