1
课程详述
COURSE SPECIFICATION
以下课程信息可能根据实际授课需要或在课程检讨之后产生变动。如对课程有任何疑问，请联
系授课教师。
The course information as follows may be subject to change, either during the session because of unforeseen
circumstances, or following review of the course at the end of the session. Queries about the course should be
directed to the course instructor.
1.
课程名称 Course Title
半导体器件及封装基础
Fundamentals of Semiconductor Devices and Packaging
2.
授课院系
Originating Department
深港微电子学院
School of Microelectronics
3.
课程编号
Course Code
SME319
4.
课程学分 Credit Value
3
5.
课程类别
Course Type
专业核心课 Major Core Courses
6.
授课学期
Semester
春季 Spring
7.
授课语言
Teaching Language
中英双语 English & Chinese
8.
授课教师、所属学系、联系方
式（如属团队授课，请列明其
他授课教师）
Instructor(s), Affiliation&
Contact
（For team teaching, please list
all instructors）
叶怀宇
深港微电子学院 副教授
Email：yehy@sustech.edu.cn
办公地点：台州楼 104
Huaiyu YE
Associate Professor, School of Microelectronics
yehy@sustech.edu.cn
Room 104,Taihou Hall
9.
实验员/助教、所属学系、联系
方式
Tutor/TA(s), Contact
待公布 To be announced
10.
选课人数限额(可不填)
Maximum Enrolment
（Optional）
2
授课方式
Delivery Method
习题/辅导/讨论
Tutorials
实验/实习
Lab/Practical
其它(请具体注明)
Other（Please specify）
总学时
Total
11.
学时数
Credit Hours
6
0
48
12.
先修课程、其它学习要求
Pre-requisites or Other
Academic Requirements
PHY105B 大学物理(下) B、EE204 半导体器件导论
13.
后续课程、其它学习规划
Courses for which this course
is a pre-requisite
14.
其它要求修读本课程的学系
Cross-listing Dept.
教学大纲及教学日历 SYLLABUS
15.
教学目标 Course Objectives
本课程主要介绍基于硅基、化合物半导体、宽禁带半导体器件等的工艺、原理、技术及应用，包括晶体管、功率器件、发
光器件、传感器件、碳化硅及氮化镓器件、超宽禁带器件、二维半导体材料器件等，并且介绍器件的封装及应用。通过本
课程让本专业学生掌握先进半导体器件及封装的基本概念、原理、工艺与应用场景。
This course will be focused on the silicon, compound semiconductors, wide bandgap materials, starts from the device
process, and then introduces the technologies and applications , including transistors, power electronics, light-emitting
diodes，sensors, SiC and GaN devices, ultra-wide bandgap semiconductors, 2D semiconductors and etc. It then
introduces the device packaging and applications. After completing the course, students should master the fundamental
principles、process and application of advanced semiconductor devices and packaging.
16.
预达学习成果 Learning Outcomes
通过本课程的学习，让学生在基于硅晶体管工艺的基础上，进一步了解功率器件、发光器件、传感器件、碳化硅及氮化镓
器件、超宽禁带器件、二维半导体材料器件及封装，及各类器件的多元化应用，能够让微电子专业的学生更加深刻的了解
半导体技术除了在数字领域外，还具有更为广阔的应用前景。具体包括，各类器件的材料、结构、工艺、封装、测试以及
应用。
After completing the course, students will understand the devices, packaging and applications of power electronics, light-
emitting diodes，sensors, SiC and GaN devices, ultra-wide bandgap semiconductors, 2D semiconductors and etc based
on the knowledge of transistor process. It will broaden the knowledge of student on semiconductors, including
materials、structure、process、packaging、testing and application.
3
17.
课程内容及教学日历 （如授课语言以英文为主，则课程内容介绍可以用英文；如团队教学或模块教学，教学日历须注明
主讲人）
Course Contents (in Parts/Chapters/Sections/Weeks. Please notify name of instructor for course section(s), if
this is a team teaching or module course.)
课程将讲授晶体管、功率器件、发光器件、传感器件、碳化硅及氮化镓器件、超宽禁带器件、二维半导体材料器件的工艺
流程及应用，并介绍器件的封装及应用。
This course will include the following chapters related on the transistors, power electronics, light-emitting diodes ，
sensors, SiC and GaN devices, ultra-wide bandgap semiconductors, 2D semiconductors and etc. It then introduces the
device packaging and applications.
主要内容包括：
（1-2 学时）课程介绍 Introduction
（3-6 学时）器件基本原理 Device physics
（7-10 学时）图形化工艺 及原理 Patterning process and principal
（11-14 学时）薄膜工艺及原理 Thin film process and principal
(15-18 学时)掺杂工艺及原理 Doping process and principal
（19-24 学时）晶体管制造原理及工艺 Process and principal for transistors
（25-30 学时）CMOS 集成制造 CMOS integration
（31-34 学时）发光器件及封装 Light-emitting diodes and packaging
（35-38 学时）功率 IGBT 器件及封装 IGBT Power electronics and packaging
（39-42 学时）SiC 器件及 GaN 器件及封装 SiC and GaN devices and packaging
（43-44 学时）MEMS 传感器及微传动器 MEMS devices including sensors and actuators
（45-46 学时）封装及集成工艺 Packaging process for integration
（47-48 学时）二维半导体材料器件 2D semiconductors
18.
教材及其它参考资料 Textbook and Supplementary Readings
参考资料 References:
Introduction to microelectronic fabrication, Richard C. Jaeger, Prentice Hall, ISBN: 9780201444940
Gallium Nitride And Silicon Carbide Power Devices ,B. Jayant Baliga, World Scientific Publishing Co Pte Ltd
ISBN: 9813109408
Fundamentals of Microsystems Packaging, Rao R. Tummala, McGraw-Hill Professional , ISBN-13：9780071371698
4
课程评估 ASSESSMENT
19.
评估形式
Type of
Assessment
评估时间
Time
占考试总成绩百分比
% of final
score
违纪处罚
Penalty
备注
Notes
出勤 Attendance
10
课堂表现
Class
Performance
30
小测验
Quiz
课程项目 Projects
平时作业
Assignments
期中考试
Mid-Term Test
期末考试
Final Exam
60
期末报告
Final
Presentation
其它（可根据需要
改写以上评估方
式）
Others (The
above may be
modified as
necessary)
20.
记分方式 GRADING SYSTEM
√A. 十三级等级制 Letter Grading
B. 二级记分制（通过/不通过） Pass/Fail Grading
课程审批 REVIEW AND APPROVAL
21.
本课程设置已经过以下责任人/委员会审议通过
This Course has been approved by the following person or committee of authority