1
课程详述
COURSE SPECIFICATION
以下课程信息可能根据实际授课需要或在课程检讨之后产生变动。如对课程有任何疑问，请
联系授课教师。
The course information as follows may be subject to change, either during the session because of unforeseen
circumstances, or following review of the course at the end of the session. Queries about the course should be
directed to the course instructor.
1.
课程名称 Course Title
超大规模集成电路工艺原理 VLSI Fabrication Technology
2.
授课院系
Originating Department
深港微电子学院 School of Microelectronics
3.
课程编号
Course Code
SME305
4.
课程学分 Credit Value
3
5.
课程类别
Course Type
专业核心课 Major Core Courses
6.
授课学期
Semester
秋季 Fall
7.
授课语言
Teaching Language
中英双语 English & Chinese
8.
授课教师、所属学系、联系方
式（如属团队授课，请列明其
他授课教师）
Instructor(s), Affiliation&
Contact
（For team teaching, please list
all instructors）
汪飞，副教授，深港微电子学院
办公室：第二科研楼 506 室
Email：wangf@sustech.edu.cn
电话：0755-8801-8509
WANG Fei, Assoc. Prof.,
School of Microelectronics
Office: Room No. 506, Faculty Research Building 2
Email: wangf@sustech.edu.cn
Telephone: 0755-8801-8509
9.
实验员/助教、所属学系、联系
方式
Tutor/TA(s), Contact
无 NA / 待公布 To be announced / 已确定的实验员/助教联系方式 Please list all
Tutor/TA(s)
蒋苓利，教学实验师
JIANG lingli, Teaching Engineer
Email：jiangll@sustech.edu.cn
10.
选课人数限额(可不填)
Maximum Enrolment
2
（Optional）
11.
授课方式
Delivery Method
讲授
Lectures
习题/辅导/讨论
Tutorials
实验/实习
Lab/Practical
其它(请具体注明)
Other（Please specify）
总学时
Total
学时数
Credit Hours
32 32 64
12.
先修课程、其它学习要求
Pre-requisites or Other
Academic Requirements
13.
后续课程、其它学习规划
Courses for which this course
is a pre-requisite
14.
其它要求修读本课程的学系
Cross-listing Dept.
教学大纲及教学日历 SYLLABUS
15. 教学目标 Course Objectives
本课程帮助学生了解建立先进半导体集成电路前段和末端工艺技术。通过讨论书中的基本原理，扩增参考文
献等，加强对每一个方向问题的理解。在上课时让学生用学到的知识去解决现实试验中出现的种种问题。通
过本节课知识点的理解学生将充分了解每一个制造工艺的优点和局限性。目的希望学生能够真正独立设计器
件，并能够在实际生产试验中发现解决问题。
This course helps students establish a basic understanding of the front- and back-end processing in modern
VLSI technology. The lectures discuss the fundamentals; the textbook and reference materials provide
amplification, as well as direction for further exploration; and the problems and projects enhance topic
understanding, and allow students to apply the knowledge gained from lectures and texts to solve practical
problems. The knowledge acquired in this course will allow the student to understand the advantages and
constrains of each fabrication technology. Students will be able to design practical fabrication strategies and
trouble-shoot manufacturing problems for various types of semiconductor devices.
16.
预达学习成果 Learning Outcomes
通过本课，学生将理解微电子加工中的一些基本工艺；将了解一系列半导体工艺技术，如热处理（氧化、扩
散、退火），离子注入，光刻，薄膜沉积（物理沉积法、化学沉积法），刻蚀（湿法刻蚀、干法刻蚀、离子
刻蚀等）的工艺设备；将获得一定的超净间动手经验；将学会分析湿法腐蚀与干法腐蚀的优劣；将比较化学
气相沉积与物理气相沉积的不同；将能评估一个工艺流程的复杂度。
After this course, the students should be able to,
1. Understand a few basic fundamental processing technologies in microelectronic fabrication technology;
2. Know the facilities for thermal processing (oxidation, diffusion, rapid- thermal annealing), ion
implantation, lithography, thin film deposition (physical and chemical), and etching (wet, dry plasma and
ion milling);
3. Gain some hand-on experience in the cleanroom;
4. Analyze the advantages and disadvantages of wet and dry etching;
5. Compare the Chemical vapor deposition and Physical vapor deposition;
6. Estimate the complexity of a process flow.
3
17.
课程内容及教学日历 （如授课语言以英文为主，则课程内容介绍可以用英文；如团队教学或模块教学，教学日历须注明
主讲人）
Course Contents (in Parts/Chapters/Sections/Weeks. Please notify name of instructor for course section(s), if
this is a team teaching or module course.)
Theory Part
Topics Reading
Lecture 1 Syllabus, Introduction
Lecture 2 Wafer substrate, cleanroom Chapters 1-4
Lecture 3 Pattern transfer: Lithography I Chapter 5
Lecture 4 Pattern transfer: Lithography II Chapter 5
Lecture 5 Etching I: Wet etching Chapter 10
Lecture 6 Etching II: Dry etching Chapter 10
Quiz 1
Lecture 7
Hot processing: Thermal
oxidation I
Chapter 6
Lecture 8
Hot processing: Thermal
oxidation II
Chapter 6
Lecture 9 Hot processing: Diffusion I Chapter 7
Lecture 10 Hot processing: Diffusion II Chapter 7
Lecture 11 Ion implantation I Chapter 8
Lecture 12 Ion implantation II Chapter 8
Quiz 2
Lecture 13 Thin films I Chapter 9
Lecture 14 Thin films II Chapter 9
Lecture 15
Isolation, contacts, and
metallization
Chapter 11
Lecture 16
Process integration, MEMS
process
Final Exam
4
Experiment Part
Topics Stage
Lecture 1 Introduction for Athena
Single step
process
simulation
Lecture 2
Mesh and initialize simulation
with Athena
Single step
process
simulation
Lecture 3 Implant simulation with Athena
Single step
process
simulation
Lecture 4 Diffuse simulation with Athena
Single step
process
simulation
Lecture 5
Deposit and etch simulation with
Athena
Single step
process
simulation
Lecture 6
Epitaxy, polishing and oxidation
simulation with Athena
Single step
process
simulation
Lecture 7 Extract simulation with Athena
Single step
process
simulation
Lecture 8 Structure simulation with Athena
Single step
process
simulation
Lecture 9
CMOS process simulation
project- Part 1
Project
simulation
Lecture 10
CMOS process simulation
project- Part 2
Project
simulation
Lecture 11
CMOS process simulation
project- Part 3
Project
simulation
Lecture 12
CMOS process simulation
project- Part 4
Project
simulation
5
Lecture 13 PECVD deposit for SiO2 and SiN
operation in
clean room
Lecture 14 Photolithography
operation in
clean room
Lecture 15 Etching for SiO2, SiN and Si
operation in
clean room
Lecture 16 Testing wih step profiler
operation in
clean room
18.
教材及其它参考资料 Textbook and Supplementary Readings
指定教材: James D. Plummer, Michael Deal, Peter D. Griffin, Silicon VLSI Technology, 2th Ed. Prentice Hall, 2008.
推荐参考资料: Stephen A. Campbell, Fabrication Engineering at the Micro- and Nanoscale,4rd Ed. Oxford University
Press, 2012
MIT OpenCourseWare: MIT 6.152J - Micro/Nano Processing Technology
课程评估 ASSESSMENT
19.
评估形式
Type of
Assessment
评估时间
Time
占考试总成绩百分比
% of final
score
违纪处罚
Penalty
备注
Notes
出勤 Attendance
课堂表现
Class
Performance
20
小测验
Quiz
10
课程项目 Projects
30
平时作业
Assignments
5
期中考试
Mid-Term Test
10
期末考试
Final Exam
10
期末报告
Final
Presentation
15
其它（可根据需要
改写以上评估方
式）
Others (The
above may be
modified as
necessary)
20.
记分方式 GRADING SYSTEM
6
A.十三级等级制 Letter Grading
B.二级记分制（通过/不通过） Pass/Fail Grading
课程审批 REVIEW AND APPROVAL
21.
本课程设置已经过以下责任人/委员会审议通过
This Course has been approved by the following person or committee of authority
