1
课程详述
COURSE SPECIFICATION
以下课程信息可能根据实际授课需要或在课程检讨之后产生变动。如对课程有任何疑问，请
联系授课教师。
The course information as follows may be subject to change, either during the session because of unforeseen
circumstances, or following review of the course at the end of the session. Queries about the course should be
directed to the course instructor.
1.
课程名称 Course Title
微电子基础 II
Fundamental of Microelectronics II
2.
授课院系
Originating Department
深港微电子学院
School of Microelectronics
3.
课程编号
Course Code
SME204
4.
课程学分 Credit Value
3
5.
课程类别
Course Type
专业选修课 Major Elective Courses
6.
授课学期
Semester
春季 Spring/秋季 Fall
7.
授课语言
Teaching Language
中英双语 English & Chinese
8.
授课教师、所属学系、联系方
式（如属团队授课，请列明其
他授课教师）
Instructor(s), Affiliation&
Contact
（For team teaching, please list
all instructors）
叶怀宇
副教授
深港微电子学院
林苑菁
助理教授
深港微电子学院
Huaiyu YE
Associate Professor，School of Microelectronics
yehy@sustech.edu.cn
Yuanjing LIN
Assistant Professor, School of Microelectronics
Linyj2020@sustech.edu.cn
9.
实验员/助教、所属学系、联系
方式
Tutor/TA(s), Contact
蒋苓利 Lingli Jiang
School of Microelectronics
Jiangll@sustech.edu.cn
10.
选课人数限额(可不填)
2
Maximum Enrolment
（Optional）
11.
授课方式
Delivery Method
讲授
Lectures
习题/辅导/讨论
Tutorials
实验/实习
Lab/Practical
其它(请具体注明)
Other（Please specify）
总学时
Total
学时数
Credit Hours
32 32 64
12.
先修课程、其它学习要求
Pre-requisites or Other
Academic Requirements
SME203 微电子基础 I
SME203 Fundamental of Microelectronics I
13.
后续课程、其它学习规划
Courses for which this course
is a pre-requisite
SME319 半导体器件及封装基础
SME319
Fundamentals of Semiconductor Devices and Packaging
14.
其它要求修读本课程的学系
Cross-listing Dept.
教学大纲及教学日历 SYLLABUS
15. 教学目标 Course Objectives
本门课的目标是
理解半导体材料特性及半导体器件的基本原理
理解多种半导体器件及其发展趋势
理解半导体器件的应用领域及半导体工业
设计和仿真计算基本半导体器件
The course objectives are:
To understand the semiconductors and semiconductor devices
To understand various semiconductor devices and device trend
To understand semiconductor application and industry
To design and simulate the basic semiconductor devices
16.
预达学习成果 Learning Outcomes
能够理解半导体材料及半导体器件的物理特性及性质
能够理解半导体材料及半导体器件的工作原理
能够应用仿真工具构建传统的器件结构，包括二极管、BJT 和 MOS晶体管。
能够应用仿真工具分析半导体器件的电气特性，包括输出特性、击穿特性、回扫特性等。
3
Upon completion of the course, the students will be able to demonstrate:
An understanding of physics and properties of semiconductors
An understanding of fundamentals of microelectronics and the semiconductor devices
An ability to apply simulation tools to construct conventional device structures, including diodes, BJT and MOS
transistors.
An ability to apply simulation tools to analyze the electrical characteristics of the devices, including output
characteristic, breakdown, snapback and so on.
17.
课程内容及教学日历 （如授课语言以英文为主，则课程内容介绍可以用英文；如团队教学或模块教学，教学日历须注明
主讲人）
Course Contents (in Parts/Chapters/Sections/Weeks. Please notify name of instructor for course section(s), if
this is a team teaching or module course.)
4
理论部分
Week 1-2: 半导体物理特性及性质
Week 3-4: 半导体中杂质和缺陷能级
Week 5-6: 半导体中载流子的统计分布
Week 7-8:半导体的导电性
Week 9-10:非平衡载流子
Week 11-12:半导体 PN 结
Week 13-14：金属半导体接触，金属绝缘体半导体电容器
Week 15-16：双极晶体管及场效应晶体管
Theory Part
Week 1-2: Physics and Properties of Semiconductors：
Week 3-4: impurities and defects in semiconductors
Week 5-6: Statistical Distribution of Carriers in Semiconductors
Week 7-8：Conductivity of Semiconductors
Week 9-10：Nonequilibrium Carriers
Week 11-12：PN Junction
Week 13-14： Metal-Semiconductor Contacts and Metal-Insulator-Semiconductor Capacitors
Week 15-16： Bipolar Transistors and MOSFETs
实验部分：
Week 1: TCAD 工具总览
Week2: Deckbuild 及 Tonyplot操作
Week3: Silvaco TCAD 工具基本语法规则
Week4: 器件结构的 Mesh 构建
Week5: 器件构建中 Region 及 material 定义
Week6: 器件构建中掺杂, 电极及接触定义
Week7: 特性仿真中物理模型、数值计算方法及界面定义
Week8: 电学特性求解
Week9: PN 结及击穿特性仿真
5
Week10: 参数提取语句
Week11: 齐纳二极管仿真
Week12: PIN 二极管仿真
Week13: 三极管仿真
Week14: MOS 器件仿真
Week15: 其他器件仿真（如太阳能电池）
Week 16: 二次击穿特性仿真
Experiment Part
Week 1: Overview of the TCAD tools
Week2: Operation of Deckbuild and Tonyplot
Week3: Basic grammar rules for Silvaco TCAD tool
Week4: Mesh definition for device construction
Week5: Region and material definition for device construction
Week6: Doping, electrode and contact definition for device construction
Week7: model method and interface definition for characteristic simulation
Week8: Electrical characteristics solution
Week9: Diode and breakdown properties simulation
Week10: Extraction with the simulation tool
Week11: Zener Diode simulation
Week12: PIN diode simulation
Week13: BJT simulation
Week14: MOS simulation
Week15: Solar cell simulation
Week 16: second breakdown simulation
18.
教材及其它参考资料 Textbook and Supplementary Readings
教材 Textbook：
Physics of Semiconductor Devices, 7
th
Edition, S. M. Sze, Kwok K. Ng
半导体物理学（第 7 版）刘恩科
课程评估 ASSESSMENT
6
19.
评估形式
Type of
Assessment
评估时间
Time
占考试总成绩百分比
% of final
score
违纪处罚
Penalty
备注
Notes
出勤 Attendance
课堂表现
Class
Performance
小测验
Quiz
课程项目 Projects 20
平时作业
Assignments
Every two weeks 25
期中考试
Mid-Term Test
Middle of the course 25
期末考试
Final Exam
End of the course 30
期末报告
Final
Presentation
其它（可根据需要
改写以上评估方
式）
Others (The
above may be
modified as
necessary)
20.
记分方式 GRADING SYSTEM
A.十三级等级制 Letter Grading
B.二级记分制（通过/不通过） Pass/Fail Grading
课程审批 REVIEW AND APPROVAL
21.
本课程设置已经过以下责任人/委员会审议通过
This Course has been approved by the following person or committee of authority
