课程大纲

COURSE SYLLABUS

课程代码/名称

Course Code/Title

Failure Mechanisms of Polymers in Microelectronic Packages

电子封装结构中的高分子材料失效行为

课程性质

Compulsory/Elective

专业选修课/Elective

课程学分/学时

Course Credit/Hours

3/64

授课语言

Teaching Language

英语/English

授课教师

Instructor(s)

王珂，薛珂

Ke Wang, Xue Ke

先修要求

Pre-requisites

无/NA

教学目标

Course Objectives

1. To provide the students with a basic understanding of the roles that polymer materials

playing in the microelectronic and microsystem packages (e-package) and its importance in

product design.

2. To provide the students with an understanding on physical and chemical properties of

polymer materials that are critical in e-package reliability.

3. To introduce the concept of material selection and design for assembly and manufacturing

of e-packages.

4. To introduce the failure behaviors and mechanisms of e-packages due to polymer materials

failure.

5. To introduce the characterization and simulation tools that are used in e-package design and

reliability assessment

6. To provide students with basic knowledge on the industry size of e-package manufacturing and the

understanding the controlling factors that detecting the quality of massive production in reality

教学方法

Teaching Methods

理论和实验/Lecture and Lab

教学内容

Course Contents

Section 1

 Review of basic concepts

 Molecular and morphological structure of polymers

o Classification of polymers

o Amorphous and crystalline polymers

o Viscoelasticity of polymeric materials

o Physical properties of polymers (T

, T

and T

)

o Characterization techniques for physical properties



Fracture mechanics

o Stress, strain and stress-strain relationship

o Stress concentration

o Plane stress and plane strain

o Elastic deformation and plastic deformation

o Fracture toughness

Section 2

 Deformation mechanisms in polymers

 Shear yielding

 Crazing

 Cracking

Section 3

 Fractography of polymers

 Optical microscopic analysis

 Scanning electron microscopic analysis

 Transmission electron microscopic analysis

 Other techniques

Section 4

 Functions of Electronic Packaging



Role of Packaging in Microelectronics



Role of Packaging in Microsystems

Section 5

 Packaging Materials and Processes

 Role of Packaging Materials

 Packaging Materials and Properties

 Packaging Materials Processing

Section 6

 Design for Environment and Reliability



Physics-based Failure Analysis



Stress Analysis and Failure Criteria



Role of Computational Simulation

Section 7

 Package Level and Board Level Reliability Tests

 Strength of Interconnects

 Tests for Moisture Sensitivity

 Tests for Thermal Aging

 Design of Experiments

 Temperature Cycling Tests

 Mechanical Tests

Section 8

 Fundamentals of Electrical & Thermal Analysis

 Cooling Requirements



Thermal Management

Section 9

 Case study

10.

课程考核

Course Assessment

请再此注明：

①

考查

考试；

②

分数构成。

 Midterm Exam (Open Book): 20%



Project report (two reports) 30%



Presentation (Individual) 50%

11.

教材及其它参考资料

Textbook and Supplementary Readings

Fracture Behaviour of Polymers，A.J. Kinloch and R.J. Young

Fundamentals of Microsystems Packaging，R. Tummala, ed.,

Advanced Electronic Packaging，Richard K. Ulrich and William D. Brown