课程大纲
COURSE SYLLABUS
1.
课程代码/名称
Course Code/Title
现代物理实验
Modern Physics Experiments
2.
课程性质
Compulsory/Elective
专业选修课
Major Elective Courses
3.
课程学分/学时
Course Credit/Hours
2/48 (16 理论 lecutre + 32 实验 lab project)
4.
授课语言
Teaching Language
Chinese
中文
5.
授课教师
Instructor(s)
崔德虎 Cui Dehu
6.
先修要求
Pre-requisites
集成电路工艺实践
Silicon VLSI Technology, Fundamentals, Practice and Modelling
7.
教学目标
Course Objectives
课程为博士研究生专业核心课。通过该门课程的学习，学生们可学习集成电路的工艺、表征等
知识，并能熟练使用集成电路工艺所使用的基本仪器，达到理论与实践相结合的目的。课程考
核方式为课程报告 50%，课程实验 50%。讲授 16 学时，实验 32 学时。
This lecture focuses on the basic features of the silicon integrated circuits manufacture， including
their distinctions and common underlying principle. Such as: CMOS Technology, lithography, etching,
various deposition techniques, vacuum technology, evaporation, ion implantation, epitaxy, chemical
vapour deposition, plasma, film analysis.
8.
教学方法
Teaching Methods
讲授
Lectures
，习题
/
辅导
/
讨论
Tutorials,
实验项目
Lab Project
9.
教学内容
Course Contents
Section 1 (2 hours)
晶体生长：晶圆片制造与硅晶圆片的基本特性，圆片的准备和规格
Crystal Growth, Wafer fabrication and basic properties of silicon wafer
Section 2 (2 hours)
半导体制造
——
洁净室、晶圆片清洗与吸杂处理
Semiconductor manufacturing, clean rooms, wafer cleaning and guttering;
Section 3 (2 hours)
光刻
Lithography;
Section 4 (2 hours)
热氧化和
Si-SiO2
界面
Thermal oxidation and Si/Sio2 interface
Section 5 (2 hours)
扩散，离子注入；
Dopant diffusion;Ion implantation;
Section 6 (2 hours)
薄膜淀积；
Thin film deposition
Section 7 (2 hours)
刻蚀
Etching;
Section 8 (2 hours)
后端工艺
Back-end technology
Lab Project (32 hours)
要求学生掌握电子器件的基本实验步骤
.
Students should master the fundamental principles of electronic m
aterials and
devices.
10.
课程考核
Course Assessment
①考试；②分数构成。
出勤及课堂表现 Attendance and class performance 10%
期末考试 Final exam 40%
课程项目及报告
Project and presentation 50%
11.
教材及其它参考资料
Textbook and Supplementary Readings
Silicon VLSI Technology, Fundamentals, Practice and Modelling
超大规模集成电路工艺技术：理论，实践及模型。
