课程详述

COURSE SPECIFICATION

以下课程信息可能根据实际授课需要或在课程检讨之后产生变动。如对课程有任何疑问，请

联系授课教师。

The course information as follows may be subject to change, either during the session because of unforeseen

circumstances, or following review of the course at the end of the session. Queries about the course should be

directed to the course instructor.

课程名称 Course Title

半导体材料与器件 Introduction to Semiconducting Materials, Devices and

Technology

授课院系

Originating Department

材料科学与工程 Department of Materials Science and Engineering

课程编号

Course Code

MSE310

课程学分 Credit Value

课程类别

Course Type

专业核心课 Major Core Courses

授课学期

Semester

春季 Spring

授课语言

Teaching Language

英文 English

授课教师、所属学系、联系方

式（如属团队授课，请列明其

他授课教师）

Instructor(s), Affiliation&

Contact

（For team teaching, please list

all instructors）

程鑫教授 Prof. Xing Cheng

材料科学与工程系 Department of Materials Science and Engineering

chengx@sustc.edu.cn

0755-88018989

实验员/助教、所属学系、联系

方式

Tutor/TA(s), Contact

待公布 To be announced

10.

选课人数限额(可不填)

Maximum Enrolment

（Optional）

授课方式

Delivery Method

讲授

Lectures

习题/辅导/讨论

Tutorials

实验/实习

Lab/Practical

其它(请具体注明)

Other（Please specify）

总学时

Total

11.

学时数

Credit Hours

12.

先修课程、其它学习要求

Pre-requisites or Other

Academic Requirements

MSE001 材料科学与工程基础 Fundamentals of Materials Science and

Engineering

13.

后续课程、其它学习规划

Courses for which this course

is a pre-requisite

N/A

14.

其它要求修读本课程的学系

Cross-listing Dept.

N/A

教学大纲及教学日历 SYLLABUS

15.

教学目标 Course Objectives

This course is an introductory course for semiconductor materials, devices and processing

technologies. The objective is to provide students in materials science and engineering major

with a broad overview of the most important areas in semiconductor technology. Topics to be

covered include properties of semiconductors, representative silicon and compound semiconductor

devices and microelectronic processing (fabrication) techniques. Due to the large amount of

materials to be covered, this course will put emphasis on the basic principles of the device

operations and the processing technologies. This course is open to all students who work with

semiconductors or wish to learn about semiconductor technologies.

16.

预达学习成果 Learning Outcomes

The goal of this course is to establish a basic understanding of the physical principles

involved in semiconductor materials, devices and processing technology. The knowledge acquired

in this course will allow the student to understand the fundamental electronic and optical

properties of semiconducting materials, the principals involved in the operation of typical

semiconductor devices such as diodes, bipolar transistors, and MOS devices, and the processing

techniques used in modern day VLSI technology. Upon completion of this course, students will

acquire a general understanding of the semiconductor industry and understand the key concepts

related to semiconductor devices and microelectronic processing technology. Students will also

be able to describe device operation and optimize processing technology through mathematical

modelling.

17.

课程内容及教学日历（如授课语言以英文为主，则课程内容介绍可以用英文；如团队教学或模块教学，教学日历须注明

主讲人）

Course Contents (in Parts/Chapters/Sections/Weeks. Please notify name of instructor for course section(s), if

this is a team teaching or module course.)

Lecture 1 (3 Credit hours): Introduction to semiconducting materials, basic properties of

semiconductors

Lecture 2 (3 Credit hours): Transport phenomena in semiconductors – drifting, diffusion,

recombination and generation

Lecture 3 (3 Credit hours): Transport phenomena in semiconductors – continuity equations

Lecture 4 (3 Credit hours): Diodes

Lecture 5 (3 Credit hours): Bipolar transistors

Lecture 6 (3 Credit hours): Metal-oxide-semiconductor capacitors

Lecture 7 (3 Credit hours): MOSFET devices

Lecture 8 (3 Credit hours): Modern MOSFET devices

Lecture 9 (3 Credit hours): Solid-state sensors

Lecture 10 (3 Credit hours): Thin-film transistors and liquid crystal display

Lecture 11 (3 Credit hours): Crystal growth and oxidation

Lecture 12 (3 Credit hours): Doping: diffusion and ion implantation

Lecture 13 (3 Credit hours): Lithographic techniques

Lecture 14 (3 Credit hours): Thin-film deposition: CVD and PVD

Lecture 15 (3 Credit hours): Etching: wet and dry

Lecture 16 (3 Credit hours): Process integration

18.

教材及其它参考资料 Textbook and Supplementary Readings

Textbook

“Semiconductor Devices: Physics and Technology”, 3rd edition, Simon M. Sze and Ming-Kwei Lee,

Wiley, 2012.

References

1. “Devices for Integrated Circuits: Silicon and III-V Compound Semiconductors”, H. Craig

Casey, Jr., Wiley, 1999.

2. “Silicon VLSI Technology: Fundamentals, Practice, and Modelling”, James D. Plummer, Michael

Deal, and Peter D. Griffin, Prentice Hall, 2001.

Lecture notes will be provided.

课程评估 ASSESSMENT

19.

评估形式

Type of

Assessment

评估时间

Time

占考试总成绩百分比

% of final

score

违纪处罚

Penalty

备注

Notes

出勤 Attendance

课堂表现

Class

Performance

小测验

Quiz

课程项目 Projects

平时作业

Assignments

期中考试

Mid-Term Test

期末考试

Final Exam

期末报告

Final

Presentation

其它（可根据需要

改写以上评估方

式）

Others (The

above may be

modified as

necessary)

20.

记分方式 GRADING SYSTEM

A. 十三级等级制 Letter Grading

 B. 二级记分制（通过/不通过） Pass/Fail Grading

课程审批 REVIEW AND APPROVAL

21.

本课程设置已经过以下责任人/委员会审议通过

This Course has been approved by the following person or committee of authority