课程详述

COURSE SPECIFICATION

以下课程信息可能根据实际授课需要或在课程检讨之后产生变动。如对课程有任何疑问，请联

系授课教师。

The course information as follows may be subject to change, either during the session because of unforeseen

circumstances, or following review of the course at the end of the session. Queries about the course should be

directed to the course instructor.

课程名称 Course Title

等离子体原理与应用

Fundamentals and applications of plasma

授课院系

Originating Department

机械与能源工程系

Department of Mechanical and Energy Engineering

课程编号

Course Code

ME452

课程学分 Credit Value

课程类别

Course Type

专业选修课 Major Elective Courses

授课学期

Semester

春季 Spring / 夏季 Summer / 秋季 Fall

授课语言

Teaching Language

中英双语 English & Chinese

授课教师、所属学系、联系方式

（如属团队授课，请列明其他授

课教师）

Instructor(s), Affiliation&

Contact

（For team teaching, please list

all instructors）

邓辉/助理教授

机械与能源工程系

Hui DENG / Assistant professor

Department of Mechanical and Energy Engineering

Email: dengh@sustech.edu.cn

实验员/助教、所属学系、联系

方式

Tutor/TA(s), Contact

待公布 To be announced

10.

选课人数限额(可不填)

Maximum Enrolment

（Optional）

授课方式

Delivery Method

讲授

Lectures

习题/辅导/讨论

Tutorials

实验/实习

Lab/Practical

其它(请具体注明)

Other（Please specify）

总学时

Total

11.

学时数

Credit Hours

12.

先修课程、其它学习要求

Pre-requisites or Other

Academic Requirements

ME302 机械制造基础 Fundamentals of Manufacturing

13.

后续课程、其它学习规划

Courses for which this course

is a pre-requisite

14.

其它要求修读本课程的学系

Cross-listing Dept.

教学大纲及教学日历 SYLLABUS

15.

教学目标 Course Objectives

等离子体是物质的第四态，它在人们的生活以及生产过程中扮演着非常重要的角色。在精密制造领

域，等离子体已经发展成为一种非常重要的技术手段。作为一门交叉学科，等离子体涉及到物理、化学、

表面科学以及工程应用等诸多内容。

本课程的教学目标是使学生掌握等离子体放电的基本原理并对等离子体的相关应用有清晰的了解。本

课程的第一部分将从物理的角度对等离子体放电过程进行分析；第二部分将阐述等离子体的化学动力学过

程；第三部分介绍各种等离子体的激发过程及特性；第四部分会对等离子体的典型应用进行介绍。

As the fourth state of mater, plasma plays an very important role in our daily life as well as industry

production. Especially in precision manufacturing, plasma has become an useful approach. To

understand the principles and applications of plasma, theoretical knowledge, such as plasma physics,

chemical kinetics, surface science and engineering is indispensable.

The objective of this course is to give an overall introduction to the principles of plasma discharge

and offer the students with the knowledge of plasma applications. In the first part, the physical

fundamentals about plasma discharge will be introduced. In the second part, chemical kinetics of

plasma will be introduced. In the third part, the properties of various plasma sources will be introduced.

Finally, some typical applications of plasma will be discussed. The students will be cultivated with the

ability to understand the principles and applications of plasma and conduct related researches.

16.

预达学习成果 Learning Outcomes

通过本课程的学习，可以期待以下的学习成果。

1. 掌握等离子体放电的原理，包括其物理和化学内涵；

2. 对等离子体的典型应用有充分了解，包括原理、优势以及局限性；

By the end of this course, students should have mastered the following abilities:

1. Understand the physical and chemical principles of plasma;

2. Be familiar with the typical applications of plasma and be able to analyse their advantages and

disadvantages.

17.

课程内容及教学日历（如授课语言以英文为主，则课程内容介绍可以用英文；如团队教学或模块教学，教学日历须注明主

讲人）

Course Contents (in Parts/Chapters/Sections/Weeks. Please notify name of instructor for course section(s), if

this is a team teaching or module course.)

课程内容

教学要求

学时

分配

1. 课程介绍

 等离子体的定义和分类；

 等离子体的基本性质和应用；

 本课程的性质、任务和主要内容；

1. Introduction

 Definition and classification of plasma;

 Basic properties and applications of plasma;

了解等离子体的基本性质，并对其

在日常生活和工业生产中的应用有

大致了解；了解本课程的教学内容

和评价方法。

Understand the basic properties

of plasma, and have a general

understanding of its application in

 The nature, tasks and main content of the

course;

daily life and industrial production;

understand the teaching content

and evaluation methods of this

course.

2. 气体放电的基本物理过程

 等离子体中的粒子；

 粒子碰撞过程中的能量转移；

2. The basic physical process of gas discharge

 Particles in the plasma;

 Energy transfer during particle collisions;

了解气体放电的基本物理过程，包

括等离子体中有哪些粒子，他们是

如何产生的，以及他们的碰撞行

为。

Understand the basic physical

processes of gas discharge,

including which particles are in

the plasma, how they are

produced, and their collision

behavior.

3. 汤生放电

 汤生放电理论；

 α 与 β 放电过程；

 汤生放电的局限性；

3. Townsend discharge

 The theory of Townsend discharge;

 α and β discharge processes;

 The limitation of Townsend theory;

掌握汤生放电理论。

Understand the Townsend

discharge theory.

4. 帕刑定律

 帕刑法则的提出过程；

 各因素的帕刑放电过程的影响；

4. Paschen’s law

 The proposal of Paschen’s law;

 Factors affecting the discharge potential;

了解帕刑法则的提出过程，并掌握

该法则在具体放电案例中的应用。

Understand the process of

proposing the Paschen’s law and

master the application of the law

in specific discharge cases.

5. 等离子体的宏观性质

 等离子体的电中性与德拜屏蔽；

 等离子体振荡；

 离子流动和密度分布；

 等离子体鞘层；

5. Macroscopic properties of plasma

 Electrical neutrality of the plasma;

 Debye shielding;

 Plasma oscillation;

 Ion flow and density distribution;

 Plasma sheath;

了解等离子体的宏观性质，掌握德

拜屏蔽、等离子体振荡与鞘层的发

生机理。

Understand the macroscopic

properties of plasma, master the

mechanism of Debye shielding,

plasma oscillation and sheath.

6. 直流放电

 各种直流放电模式；

 辉光放电与低温等离子体；

 弧光放电与热等离子体；

6. Direct current discharge

 Various DC discharge modes;

 Glow discharge and low temperature

plasma;

 Arc discharge and thermal plasma;

对各种形式的直流放电的性质有所

了解。

Know the nature of various forms

of DC discharge.

7. 射频与微波等离子体

 等离子体生成与天线耦合；

 电容耦合等离子体；

 电感耦合等离子体；

7. RF and microwave plasma

掌握 CCP 与 ICP 的基本性质。

Understand the fundamentals of

CCP and ICP.

 Plasma generation coupled to the antenna;

 Capacitively coupled plasma;

 Inductively coupled plasma;

8. 等离子体辅助抛光

 抛光加工简介；

 等离子体辅助抛光的基本原理；

 等离子体辅助抛光单晶碳化硅；

 等离子体辅助抛光单晶氮化镓；

8. Plasma assisted polishing

 Fundamentals of polishing;

 Principles of plasma assisted polishing;

 Application of PAP to 4H-SiC;

 Application of PAP to GaN;

掌握等离子体辅助抛光的基本原

理，并对其在难加工材料的抛光领

域的应用有所了解。

Master the basic principles of

plasma-assisted polishing and

understand its application in the

polishing of difficult-to-machine

materials.

9. 等离子体加工

 等离子体化学气化加工；

 等离子体射流成形加工；

 等离子体加工多相材料；

 其他的等离子体加工技术；

9. Plasma assisted machining

 Plasma chemical vaporization machining;

 Plasma jet figuring;

 Plasma machining of multiphase materials;

 Other plasma-based machining techniques;

了解国内外在等离子体加工领域的

最新进展，掌握各种等离子体加工

技术的基本原理。

Understand the latest

developments in plasma

processing at home and abroad,

and master the basic principles of

various plasma processing

technologies.

10. 等离子体表面改性

 等离子体粘合的最新进展；

 含氟树脂的基本性质；

 等离子体粘合技术的原理；

 应用展望；

10. Plasma assisted surface modification

 Recent advances in plasma bonding;

 The basic properties of fluorine resins;

 The principle of plasma bonding technology;

 Application outlook;

掌握等离子体表面改性的基本原理

和应用。

Understand the mechanisms of

plasma surface modification and

its applications.

11. 等离子体沉积

 等离子体物理气相沉积

 等离子体化学气相沉积

11. Plasma deposition

 Physical vapor deposition;

 Chemical vapor deposition;

掌握基于等离子体的物理气相沉积

和化学气相沉积技术。

Understand the plasma-based

PVD and CVD technologies.

12. 等离子体刻蚀

 刻蚀要求和工艺过程；

 刻蚀反应动力学；

 一些刻蚀体系；

 衬底上的电荷积累；

12. Plasma etching

 Etching requirements and processes;

 Etching reaction kinetics;

 Some etching systems;

 Charge accumulation on the substrate;

学习等离子体刻蚀的原理，掌握常

见的等离子体刻蚀工艺，能够就具

体的刻蚀案例进行分析。

Learn the principle of plasma

etching, master the common

plasma etching process, and

analyse the specific etching

cases.

13. 微波等离子体生长金刚石

 金刚石的基本性质；

 单晶金刚石的各种生长工艺；

掌握微波等离子体生长金刚石技术

的原理和工艺。

Understand the mechanism and

 微波等离子体生长金刚石技术；

13. Growth of single crystal diamond using

microwave plasma

 The basic properties of diamonds;

 Various growth processes for single crystal

diamonds;

 Microwave plasma growth diamond

technology;

process of microwave plasma-

based synthesis of single crystal

diamond.

14. 等离子体灭菌

 灭菌的基本要求和常见工艺；

 等离子体灭菌的基本原理；

 一种纸基等离子体灭菌器的介绍；

14. Plasma sterilization

 Basic requirements for sterilization and

common processes;

 The basic principle of plasma sterilization;

 Introduction to a paper-based plasma

sterilizer;

学习等离子体灭菌技术，掌握其基

本原理，了解常见的等离子体灭菌

器的设计。

Learn plasma sterilization

technology, master its basic

principles, and understand the

design of common plasma

sterilizers.

15. 等离子体诊断

 等离子体诊断的要求；

 各种等离子体诊断技术；

 OES 光谱诊断的原理和应用；

15. Plasma diagnostics

 Requirements for plasma diagnostics;

 Various plasma diagnostic techniques;

 Principles and applications of OES spectral

diagnosis;

了解等离子体诊断的基本原理和应

用。

Understand the mechanisms and

applications of plasma diagnostic

techniques.

16. 等离子体仿真

 等离子体仿真的基本要求；

 基于 COMSOL 的等离子体流场和电磁场仿

真；

 基于 LAMMPS 的等离子体分子动力学仿真；

 基于密度泛函理论(DFT)的等离子体第一性原

理计算；

16. Plasma simulation

 Basic requirements for plasma simulation;

 COMSOL-based plasma flow field and

electromagnetic field simulation;

 Plasma molecular dynamics simulation

based on LAMMPS;

 Plasma first-principles calculation based on

density functional theory (DFT);

了解等离子体仿真的基本要求，能

够从不同的尺度对一些常见放电体

系进行仿真计算。

Understand the basic

requirements of plasma

simulation, and be able to

simulate some common

discharge systems from different

scales.

18.

教材及其它参考资料 Textbook and Supplementary Readings

教材：Principles of Plasma Discharges and Materials Processing, Michael A. Lieberman, Alan J.

Lichtenberg, John Wiley & Sons, 8 Apr 2005

课程评估 ASSESSMENT

19.

评估形式

Type of

Assessment

评估时间

Time

占考试总成绩百分比

% of final

score

违纪处罚

Penalty

备注

Notes

出勤 Attendance

课堂表现

Class

Performance

小测验

Quiz

课程项目 Projects

平时作业

Assignments

期中考试

Mid-Term Test

期末考试

Final Exam

期末报告

Final

Presentation

其它（可根据需要

改写以上评估方

式）

Others (The

above may be

modified as

necessary)

20.

记分方式 GRADING SYSTEM

√ A. 十三级等级制 Letter Grading

 B. 二级记分制（通过/不通过） Pass/Fail Grading

课程审批 REVIEW AND APPROVAL

21.

本课程设置已经过以下责任人/委员会审议通过

This Course has been approved by the following person or committee of authority

机械与能源工程系教学委员会