1
课程详述
COURSE SPECIFICATION
以下课程信息可能根据实际授课需要或在课程检讨之后产生变动。如对课程有任何疑问,请联
系授课教师。
The course information as follows may be subject to change, either during the session because of unforeseen
circumstances, or following review of the course at the end of the session. Queries about the course should be
directed to the course instructor.
1.
课程名称 Course Title
等离子体原理与应用
Fundamentals and applications of plasma
2.
授课院系
Originating Department
机械与能源工程系
Department of Mechanical and Energy Engineering
3.
课程编号
Course Code
ME452
4.
课程学分 Credit Value
3
5.
课程类别
Course Type
专业选修课 Major Elective Courses
6.
授课学期
Semester
春季 Spring / 夏季 Summer / 秋季 Fall
7.
授课语言
Teaching Language
中英双语 English & Chinese
8.
授课教师、所属学系、联系方
(如团队课,明其
课教师)
Instructor(s), Affiliation&
Contact
For team teaching, please list
all instructors
邓辉/助理教授
机械与能源工程系
Hui DENG / Assistant professor
Department of Mechanical and Energy Engineering
Email: dengh@sustech.edu.cn
9.
/
方式
Tutor/TA(s), Contact
待公布 To be announced
10.
选课人数限额(不填)
Maximum Enrolment
Optional
授课方式
Delivery Method
讲授
Lectures
习题/辅导/讨论
Tutorials
其它(请具体注)
OtherPlease specify
总学时
Total
11.
学时数
Credit Hours
48
48
2
12.
先修课程、其它学习要求
Pre-requisites or Other
Academic Requirements
ME302 机械制造基础 Fundamentals of Manufacturing
13.
后续课程、其它学习规划
Courses for which this course
is a pre-requisite
14.
其它要求修读本课程的学系
Cross-listing Dept.
教学大纲及教学日历 SYLLABUS
15.
教学目标 Course Objectives
域,等离子体已经发展成为一种非常重要的技术手段。作为一门交叉学科,等离子体涉及到物理、化学、
表面科学以及工程应用等诸多内容。
本课程的教学目标是使学生掌握等离子体放电的基本原理并对等离子体的相关应用有清晰的了解。本
课程的第一部分将从物理的角度对等离子体放电过程进行分析;第二部分将阐述等离子体的化学动力学过
程;第三部分介绍各种等离子体的激发过程及特性;第四部分会对等离子体的典型应用进行介绍。
As the fourth state of mater, plasma plays an very important role in our daily life as well as industry
production. Especially in precision manufacturing, plasma has become an useful approach. To
understand the principles and applications of plasma, theoretical knowledge, such as plasma physics,
chemical kinetics, surface science and engineering is indispensable.
The objective of this course is to give an overall introduction to the principles of plasma discharge
and offer the students with the knowledge of plasma applications. In the first part, the physical
fundamentals about plasma discharge will be introduced. In the second part, chemical kinetics of
plasma will be introduced. In the third part, the properties of various plasma sources will be introduced.
Finally, some typical applications of plasma will be discussed. The students will be cultivated with the
ability to understand the principles and applications of plasma and conduct related researches.
16.
预达学习成果 Learning Outcomes
通过本课程的学习,可以期待以下的学习成果。
1. 掌握等离子体放电的原理,包括其物理和化学内涵;
2. 对等离子体的典型应用有充分了解,包括原理、优势以及局限性;
By the end of this course, students should have mastered the following abilities:
1. Understand the physical and chemical principles of plasma;
2. Be familiar with the typical applications of plasma and be able to analyse their advantages and
disadvantages.
17.
课程内容及教学日历 (如授课语言以英文为主,则课程内容介绍可以用英文;如团队教学或模块教学,教学日历须注明主
讲人)
Course Contents (in Parts/Chapters/Sections/Weeks. Please notify name of instructor for course section(s), if
this is a team teaching or module course.)
课程内容
教学要求
学时
分配
1. 课程介绍
等离子体的定义和分类;
等离子体的基本性质和应用;
本课程的性质、任务和主要内容;
1. Introduction
Definition and classification of plasma;
Basic properties and applications of plasma;
了解等离子体的基本性质,并对其
在日常生活和工业生产中的应用有
大致了解;了解本课程的教学内容
和评价方法。
Understand the basic properties
of plasma, and have a general
understanding of its application in
2
3
The nature, tasks and main content of the
course;
daily life and industrial production;
understand the teaching content
and evaluation methods of this
course.
2. 气体放电的基本物理过程
等离子体中的粒子;
粒子碰撞过程中的能量转移;
2. The basic physical process of gas discharge
Particles in the plasma;
Energy transfer during particle collisions;
了解气体放电的基本物理过程,包
括等离子体中有哪些粒子,他们是
如何产生的,以及他们的碰撞行
为。
Understand the basic physical
processes of gas discharge,
including which particles are in
the plasma, how they are
produced, and their collision
behavior.
4
3. 汤生放电
汤生放电理论;
α β 放电过程;
汤生放电的局限性;
3. Townsend discharge
The theory of Townsend discharge;
α and β discharge processes;
The limitation of Townsend theory;
掌握汤生放电理论。
Understand the Townsend
discharge theory.
4
4. 帕刑定律
帕刑法则的提出过程;
各因素的帕刑放电过程的影响;
4. Paschen’s law
The proposal of Paschen’s law;
Factors affecting the discharge potential;
了解帕刑法则的提出过程,并掌握
该法则在具体放电案例中的应用。
Understand the process of
proposing the Paschen’s law and
master the application of the law
in specific discharge cases.
2
5. 等离子体的宏观性质
等离子体的电中性与德拜屏蔽;
等离子体振荡;
离子流动和密度分布;
等离子体鞘层;
5. Macroscopic properties of plasma
Electrical neutrality of the plasma;
Debye shielding;
Plasma oscillation;
Ion flow and density distribution;
Plasma sheath;
了解等离子体的宏观性质,掌握德
拜屏蔽、等离子体振荡与鞘层的发
生机理。
Understand the macroscopic
properties of plasma, master the
mechanism of Debye shielding,
plasma oscillation and sheath.
4
6. 直流放电
各种直流放电模式;
辉光放电与低温等离子体;
弧光放电与热等离子体;
6. Direct current discharge
Various DC discharge modes;
Glow discharge and low temperature
plasma;
Arc discharge and thermal plasma;
对各种形式的直流放电的性质有所
了解。
Know the nature of various forms
of DC discharge.
2
7. 射频与微波等离子体
等离子体生成与天线耦合;
电容耦合等离子体;
电感耦合等离子体;
7. RF and microwave plasma
掌握 CCP ICP 的基本性质。
Understand the fundamentals of
CCP and ICP.
4
4
Plasma generation coupled to the antenna;
Capacitively coupled plasma;
Inductively coupled plasma;
8. 等离子体辅助抛光
抛光加工简介;
等离子体辅助抛光的基本原理;
等离子体辅助抛光单晶碳化硅;
等离子体辅助抛光单晶氮化镓;
8. Plasma assisted polishing
Fundamentals of polishing;
Principles of plasma assisted polishing;
Application of PAP to 4H-SiC;
Application of PAP to GaN;
掌握等离子体辅助抛光的基本原
理,并对其在难加工材料的抛光领
域的应用有所了解。
Master the basic principles of
plasma-assisted polishing and
understand its application in the
polishing of difficult-to-machine
materials.
4
9. 等离子体加工
等离子体化学气化加工;
等离子体射流成形加工;
等离子体加工多相材料;
其他的等离子体加工技术;
9. Plasma assisted machining
Plasma chemical vaporization machining;
Plasma jet figuring;
Plasma machining of multiphase materials;
Other plasma-based machining techniques;
了解国内外在等离子体加工领域的
最新进展,掌握各种等离子体加工
技术的基本原理。
Understand the latest
developments in plasma
processing at home and abroad,
and master the basic principles of
various plasma processing
technologies.
4
10. 等离子体表面改性
等离子体粘合的最新进展;
含氟树脂的基本性质;
等离子体粘合技术的原理;
应用展望;
10. Plasma assisted surface modification
Recent advances in plasma bonding;
The basic properties of fluorine resins;
The principle of plasma bonding technology;
Application outlook;
掌握等离子体表面改性的基本原理
和应用。
Understand the mechanisms of
plasma surface modification and
its applications.
2
11. 等离子体沉积
等离子体物理气相沉积
等离子体化学气相沉积
11. Plasma deposition
Physical vapor deposition;
Chemical vapor deposition;
掌握基于等离子体的物理气相沉积
和化学气相沉积技术。
Understand the plasma-based
PVD and CVD technologies.
2
12. 等离子体刻蚀
刻蚀要求和工艺过程;
刻蚀反应动力学;
一些刻蚀体系;
衬底上的电荷积累;
12. Plasma etching
Etching requirements and processes;
Etching reaction kinetics;
Some etching systems;
Charge accumulation on the substrate;
学习等离子体刻蚀的原理,掌握常
见的等离子体刻蚀工艺,能够就具
体的刻蚀案例进行分析。
Learn the principle of plasma
etching, master the common
plasma etching process, and
analyse the specific etching
cases.
4
13. 微波等离子体生长金刚石
金刚石的基本性质;
单晶金刚石的各种生长工艺;
掌握微波等离子体生长金刚石技术
的原理和工艺。
Understand the mechanism and
2
5
微波等离子体生长金刚石技术;
13. Growth of single crystal diamond using
microwave plasma
The basic properties of diamonds;
Various growth processes for single crystal
diamonds;
Microwave plasma growth diamond
technology;
process of microwave plasma-
based synthesis of single crystal
diamond.
14. 等离子体灭菌
灭菌的基本要求和常见工艺;
等离子体灭菌的基本原理;
一种纸基等离子体灭菌器的介绍;
14. Plasma sterilization
Basic requirements for sterilization and
common processes;
The basic principle of plasma sterilization;
Introduction to a paper-based plasma
sterilizer;
学习等离子体灭菌技术,掌握其基
本原理,了解常见的等离子体灭菌
器的设计。
Learn plasma sterilization
technology, master its basic
principles, and understand the
design of common plasma
sterilizers.
2
15. 等离子体诊断
等离子体诊断的要求;
各种等离子体诊断技术;
OES 光谱诊断的原理和应用;
15. Plasma diagnostics
Requirements for plasma diagnostics;
Various plasma diagnostic techniques;
Principles and applications of OES spectral
diagnosis;
了解等离子体诊断的基本原理和应
用。
Understand the mechanisms and
applications of plasma diagnostic
techniques.
2
16. 等离子体仿真
等离子体仿真的基本要求;
基于 COMSOL 的等离子体流场和电磁场仿
真;
基于 LAMMPS 的等离子体分子动力学仿真;
基于密度泛函理论(DFT)的等离子体第一性原
理计算;
16. Plasma simulation
Basic requirements for plasma simulation;
COMSOL-based plasma flow field and
electromagnetic field simulation;
Plasma molecular dynamics simulation
based on LAMMPS;
Plasma first-principles calculation based on
density functional theory (DFT);
了解等离子体仿真的基本要求,能
够从不同的尺度对一些常见放电体
系进行仿真计算。
Understand the basic
requirements of plasma
simulation, and be able to
simulate some common
discharge systems from different
scales.
4
18.
教材及其它参考资料 Textbook and Supplementary Readings
教材:Principles of Plasma Discharges and Materials Processing, Michael A. Lieberman, Alan J.
Lichtenberg, John Wiley & Sons, 8 Apr 2005
课程评估 ASSESSMENT
19.
评估形式
Type of
Assessment
评估时间
Time
占考试总成绩百分比
% of final
score
违纪处罚
Penalty
备注
Notes
出勤 Attendance
10