4. 描述机械工程、半导体工业、航空、光学、能源工程领域重要的镀膜技术,理解其物理化学过程。
5. 理解重要的分析表界面微观组织、原子结构、三维形貌、粗糙度、化学成分的表征手段的基本原理。
描述扫描电镜、透射电镜观察显像和分析取向关系的原理,认识在表界面的电镜测试中衬度、分辨
率、景深等的含义,熟知电镜研究的优越性和局限性。
6. 了解表界面对电子传输过程的影响,认识调控表界面粗糙度、亚表面缺陷在半导体工业中的应用。
7. 描述晶界、析出物-基体相界与固体力学性能的关系。认识晶界工程学的概念,熟悉其在新材料研发中
的应用。
The objective of this course is to acquaint students in Mechanical Engineering, Materials Science and Engineering,
Applied Physics, Chemistry, Aerospace Engineering, and Microelectronics Science and Engineering with fundamental
theory, application and analysis methods in the field of surface and interface science. After the course the student
should be able to:
1. Know Miller index and basics of Crystallography. Calculate the surface energy of a given surface with simple
index. Understand the concept of γ-surface and the connection between energy and atomic arrangement.
2. Describe different kinds of defects in solid and their importance in science and engineering. Know different
types of interface, and give the physical meaning of the misorientation, point defects, and coherent/incoherent
relation in interface.
3. Describe the basic kinetic models for absorption and segregation in surface and interface, understand the
underlying mechanism. Know fundamental catalytic reactions and related simple kinetic models. Describe the
diffusion process and governing parameters of surface and interface.
4. Describe the important methods to grow thin films in mechanical engineering, semiconductor, aerospace,
optical industry, and energy engineering. Understand the physics and chemistry in thin film technology.
5. Know the fundamental methods for characterizing microstructure, atomic configuration, roughness, 3D
tomography, and composition distribution of surface and interface. Describe the theory of imaging and
orientation investigation in electron microscope. Understand the meaning of contrast, resolution, depth of field
in microscope. Know the cons and pros of scanning electron microscope and transmission electron
microscope.
6. Know the influence of interface and surface structures on the electron transfer. Understand the importance of
controlling surface roughness and defect in semiconductor industry.
Describe the relation between interface, such as grain boundary and precipitate-matrix interface, and mechanical
properties of solids. Understand the concept of grain boundary engineering and its application in design of new
materials.