After completing this course, the students will be able to:
1. List major semiconductors, semiconductor devices, products based on semiconductor materials and applications
2. Understand the concept of primitive cells, unit cells and the 14 Bravais lattices.
3. Use Miller indices in labelling crystal directions, planes, and families. Calculate interplanar distances of lattices.
4. Identify various defect types in common semiconductors and calculate interstitial and vacancy concentrations in
equilibrium. Understand the significance of crystallinity, lattice matching and thermal expansion matching
5. Compare Si and GaAs in the applications, sketch Si and GaAs unit cell, identify (with Miller indices) and sketch major
crystal orientations and planes. List common dopants in Si and identify intrinsic and extrinsic semiconductors. Identify
common 2D semiconductor unit cells
6. Understand the use, working principle and the limitations of major material analysis techniques such as XRD, AFM,
SEM, EPD, SIMS and TEM in industry and research practice.
7. Apply Bragg’s law to identify XRD peaks and their Miller indices, and calculate strains. Apply the tensor format of the
Hook’s law for simple stress and strain cases. Understand the difference between powder diffraction and single crystal
diffraction. Use the XRD technique to measure wafer title angles and orientations.
7. Know basic lab safety rules and practice.
8. Understand common epitaxy techniques. Calculate lattice mismatch strains and thermal strains.
课程内容及教学日历 (如授课语言以英文为主,则课程内容介绍可以用英文;如团队教学或模块教学,教学日历须注明
主讲人)
Course Contents (in Parts/Chapters/Sections/Weeks. Please notify name of instructor for course section(s), if
this is a team teaching or module course.)