工业实习的实习内容与方法,由实习单位与指导老师共同研究决定,应体现课程知识内容的应用与实践。具体实习内容可
以包括但不限于:
1.通信
分子通信、纳米通信、纳米物联网、纳米传感网、生物可溶性微纳米系统、大规模多天线系统、异构社交网络、多层无线
系统资源调度及优化、整合认知无线系统等多尺度通信及感知技术、绿色通信、绿色感知、能量收集技术、可见光通信、
电力线通信、无线信息和功率传输、轨道角动量调制技术等天线、微波及射频滤波器、放大器、混频器等器件设计以及系
统集成、空间映射技术、替代模型建模优化、电磁仿真调试技术、微波器件计算机辅助设计等领域的应用。
2.微电
半导体物理、电子功能材料、固态器件、集成电路设计、微机电系统和半导体制造技术等领域的应用。
3.光电
半导体物理、电子功能材料、半导体光学、光学设计、激光器件、光纤通信、平板显示技术、半导体照明技术、光电器件
工艺、半导体制造技术等领域的应用。
4.信息
图像处理、语音处理、智能装备、模式识别、机器学习、遥感原理、计算机视觉、人工智能、分子通信、纳米通信、纳米
物联网、纳米传感网、生物可溶性微纳米系统、大规模多天线系统、异构社交网络、多层无线系统资源调度及优化、整合
认知无线系统等多尺度通信及感知技术、绿色通信、绿色感知、能量收集技术、可见光通信、电力线通信、无线信息和功
率传输、轨道角动量调制技术等天线、微波及射频滤波器、放大器、混频器等器件设计以及系统集成、空间映射技术、替
代模型建模优化、电磁仿真调试技术、微波器件计算机辅助设计等领域的应用。
The specific details and methods of industrial practice should be determined by the company and supervisor at
SUSTech, which must concentrate on the application of the corresponding professional/academic knowledge. The
details can include (but not limited):
1. Communication
Molecular communication, nano-communication, nano-internet, nano-sensor network, bio-soluble micro-nano system,
large-scale multi-antenna system, heterogeneous social network, multi-layer wireless system resource scheduling and
optimization, integrated cognitive wireless system and other multi-scale communication and sensing, green
communication, green sensing, energy harvesting technology, visible light communication, power line communication,
wireless information and power transmission, orbital angular momentum modulation technology, antennas, microwave
and RF filters, integration of amplifiers and mixers, space mapping technology, alternative model modeling optimization,
electromagnetic simulation debugging technology, computer aided design of microwave devices, etc.
2. Microelectronic
Semiconductor physics, electronic functional materials, solid state devices, integrated circuit design, MEMS, and
semiconductor manufacturing technologies.
3. Optoelectronic
Semiconductor physics, electronic functional materials, semiconductor optics, optical design, laser devices, fiber optic
communications, flat panel display technology, semiconductor lighting technology, optoelectronic device technology,
semiconductor manufacturing technology, etc.