1
课程详述
COURSE SPECIFICATION
以下课程信息可能根据实际授课需要或在课程检讨之后产生变动。如对课程有任何疑问，请联
系授课教师。
The course information as follows may be subject to change, either during the session because of unforeseen
circumstances, or following review of the course at the end of the session. Queries about the course should be
directed to the course instructor.
1.
课程名称 Course Title
INTRODUCTION TO MEMS
2.
授课院系
Originating Department
Electronic Engineering
3.
课程编号
Course Code
EE306
4.
课程学分 Credit Value
3
5.
课程类别
Course Type
专业核心课 Major Core Courses
6.
授课学期
Semester
春季 Spring
7.
授课语言
Teaching Language
英文 English
8.
授课教师、所属学系、联系方
式（如属团队授课，请列明其
他授课教师）
Instructor(s), Affiliation&
Contact
（For team teaching, please list
all instructors）
Jaewon PARK
Assistant Professor
Dept. of Electronic and Electronic Engineering
Rm.324, No.2 Research Bldg.
jwpark@sustech.edu.cn
0755-8801-8500
9.
实验员/助教、所属学系、联系
方式
Tutor/TA(s), Contact
Song Huixue
Dept. of Electronic and Electronic Engineering
TA - songhx@mail.sustc.edu.cn
10.
选课人数限额(可不填)
Maximum Enrolment
（Optional）
100
授课方式
Delivery Method
讲授
Lectures
习题/辅导/讨论
Tutorials
实验/实习
Lab/Practical
其它(请具体注明)
Other（Please specify）
总学时
Total
11.
学时数
Credit Hours
32
32
64
2
12.
先修课程、其它学习要求
Pre-requisites or Other
Academic Requirements
PHY105B General Physics B (II)
13.
后续课程、其它学习规划
Courses for which this course
is a pre-requisite
This course is a microelectronic core course. This course introduces 1) the principles of
typical MEMS transducers and sensors, and 2) the design and fabrication of MEMS
devices. In addition to theoretical models, this course emphasizes on the exploration of
commercially viable MEMS products for applications in electronics, sensors,
communications, and biomedical engineering.
14.
其它要求修读本课程的学系
Cross-listing Dept.
None
教学大纲及教学日历 SYLLABUS
15.
教学目标 Course Objectives
This course topics covered in this course include various transduction and sensing mechanisms (capacitive,
piezoelectric, piezoresistive, magnetic, and thermal), and MEMS fabrication technologies (silicon bulk and surface
micromachining, planar thin-film processing, wafer bonding, etching, and lithography). Upon completion, this course
enables students to have an in-depth understanding of many MEMS products such as accelerometers, gyroscopes,
pressure sensor, actuators, microphone and microfluidics devices. It also provides students with the knowledge of MEMS
processes and skills to design and optimize novel MEMS products for new applications.
16.
预达学习成果 Learning Outcomes
After completing this course, the students will be able to:
1) Understand overall flow of MEMS development
2) Familiarize themselves to various MEMS devices such as accelerometers, gyroscopes, pressure sensors and etc.
3) Design basic MEMS devices
4) Understand major fabrication techniques used in the MEMS field and find proper fabrication methods for the designed
MEMS devices
5) Come up with creative ideas in using micromachining and MEMS devices in new applications
17.
课程内容及教学日历 （如授课语言以英文为主，则课程内容介绍可以用英文；如团队教学或模块教学，教学日历须注明
主讲人）
Course Contents (in Parts/Chapters/Sections/Weeks. Please notify name of instructor for course section(s), if
this is a team teaching or module course.)
3
1.Introduction / History and future trends of MEMS
2.Overview of Microfabrication Technology I
3.Overview of Microfabrication Technology II
4.Silicon bulk micromachining
5.Surface micromachining
6.Review of electrical and mechanical concepts
7.Electrostatic sensors and actuators
8.Thermal sensors and actuators
9.Piezoresistive sensors
10.Magnetic sensing and actuation
11.Piezoelectric sensors and actuators
12.Other sensing methods
13.Final Presentation
14.Final Presentation
15.Seminar - TBD
18.
教材及其它参考资料 Textbook and Supplementary Readings
Foundations of MEMS
Author: Chang Liu
Edition: 2nd
Publisher: Prentice Hall, Publication Date: March18, 2011
Internet reference materials for MEMS: http://www.memscentral.com/
课程评估 ASSESSMENT
19.
评估形式
Type of
Assessment
评估时间
Time
占考试总成绩百分比
% of final
score
违纪处罚
Penalty
备注
Notes
出勤 Attendance
5
课堂表现
Class
Performance
小测验
Quiz
课程项目 Projects
平时作业
Assignments
10
期中考试
30
4
Mid-Term Test
期末考试
Final Exam
期末报告
Final
Presentation
30
其它（可根据需要
改写以上评估方
式）
Others (The
above may be
modified as
necessary)
Lab session
25
20.
记分方式 GRADING SYSTEM
☑ A. 十三级等级制 Letter Grading
B. 二级记分制（通过/不通过） Pass/Fail Grading
课程审批 REVIEW AND APPROVAL
21.
本课程设置已经过以下责任人/委员会审议通过
This Course has been approved by the following person or committee of authority
