1
课程详述
COURSE SPECIFICATION
以下课程信息可能根据实际授课需要或在课程检讨之后产生变动。如对课程有任何疑问，请联
系授课教师。
The course information as follows may be subject to change, either during the session because of unforeseen
circumstances, or following review of the course at the end of the session. Queries about the course should be
directed to the course instructor.
1.
课程名称 Course Title
集成电路工艺原理 Introduction to VLSI Technology
2.
授课院系
Originating Department
电子与电气工程系
Department of Electrical & Electronic Engineering
3.
课程编号
Course Code
EE305
4.
课程学分 Credit Value
3
5.
课程类别
Course Type
专业基础课 Major Foundational Courses
6.
授课学期
Semester
秋季 Fall
7.
授课语言
Teaching Language
英文 English
8.
授课教师、所属学系、联系方
式（如属团队授课，请列明其
他授课教师）
Instructor(s), Affiliation&
Contact
（For team teaching, please list
all instructors）
汪飞，副教授，电子与电气工程系，Email: wangf@sustech.edu.cn
Fei Wang, Associate Professor, Department of Electrical & Electronic Engineering,
Email: wangf@sustech.edu.cn
9.
实验员/助教、所属学系、联系
方式
Tutor/TA(s), Contact
蒋苓利，教学工程师，电子与电气工程系，Email: jiangll@sustech.edu.cn
张玉龙，助教，电子与电气工程系，Email: zhangyl3@mail.sustech.edu.cn
Dr. Lingli Jiang, Teaching Engineer, Department of Electrical & Electronic Engineering,
Email: jiangll@sustech.edu.cn
Mr.Yulong Zhang, Department of Electrical & Electronic Engineering,
Email: zhangyl3@mail.sustech.edu.cn
10.
选课人数限额(可不填)
Maximum Enrolment
（Optional）
100
2
授课方式
Delivery Method
讲授
Lectures
习题/辅导/讨论
Tutorials
实验/实习
Lab/Practical
其它(请具体注明)
Other（Please specify）
总学时
Total
11.
学时数
Credit Hours
32
32
64
12.
先修课程、其它学习要求
Pre-requisites or Other
Academic Requirements
EE203 固态电子学
EE203 Solid State Electronics
13.
后续课程、其它学习规划
Courses for which this course
is a pre-requisite
EE306 微机电系统基础
EE306 Introduction to MEMS
14.
其它要求修读本课程的学系
Cross-listing Dept.
无 None
教学大纲及教学日历 SYLLABUS
15.
教学目标 Course Objectives
本课程帮助学生了解建立先进半导体集成电路前段和末端工艺技术。通过讨论书中的基本原理，扩增参考文献等，加强对
每一个方向问题的理解。在上课时让学生用学到的知识去解决现实试验中出现的种种问题。通过本节课知识点的理解学生
将充分了解每一个制造工艺的优点和局限性。目的希望学生能够真正独立设计器件，并能够在实际生产试验中发现解决问
题。
This course helps students establish a basic understanding of the front- and back-end processing in modern VLSI
technology. The lectures discuss the fundamentals; the textbook and reference materials provide amplification, as well as
direction for further exploration; and the problems and projects enhance topic understanding, and allow students to apply
the knowledge gained from lectures and texts to solve practical problems. The knowledge acquired in this course will
allow the student to understand the advantages and constrains of each fabrication technology. Students will be able to
design practical fabrication strategies and trouble-shoot manufacturing problems for various types of semiconductor
devices.
16.
预达学习成果 Learning Outcomes
通过本课，学生将理解微电子加工中的一些基本工艺；将了解一系列半导体工艺技术，如热处理（氧化、扩散、退火），
离子注入，光刻，薄膜沉积（物理沉积法、化学沉积法），刻蚀（湿法刻蚀、干法刻蚀、离子刻蚀等）的工艺设备；将获
得一定的超净间动手经验；将学会分析湿法腐蚀与干法腐蚀的优劣；将比较化学气相沉积与物理气相沉积的不同；将能评
估一个工艺流程的复杂度。
After this course, the students should be able to,
1. Understand a few basic fundamental processing technologies in microelectronic fabrication technology;
2. Know the facilities for thermal processing (oxidation, diffusion, rapid- thermal annealing), ion implantation,
lithography, thin film deposition (physical and chemical), and etching (wet, dry plasma and ion milling);
3. Gain some hand-on experience in the cleanroom;
4. Analyze the advantages and disadvantages of wet and dry etching;
5. Compare the Chemical vapor deposition and Physical vapor deposition;
6. Estimate the complexity of a process flow.
17.
课程内容及教学日历 （如授课语言以英文为主，则课程内容介绍可以用英文；如团队教学或模块教学，教学日历须注明
主讲人）
Course Contents (in Parts/Chapters/Sections/Weeks. Please notify name of instructor for course section(s), if
this is a team teaching or module course.)
3
Topics
Reading
Lecture 1
Syllabus, Introduction
Lecture 2
Wafer substrate, cleanroom
Chapters
1-4
Lecture 3
Pattern transfer: Lithography I
Chapter 5
Lecture 4
Pattern transfer: Lithography II
Chapter 5
Lecture 5
Etching I: Wet etching
Chapter 10
Lecture 6
Etching II: Dry etching
Chapter 10
Quiz 1
Lecture 7
Hot processing: Thermal
oxidation I
Chapter 6
Lecture 8
Hot processing: Thermal
oxidation II
Chapter 6
Lecture 9
Hot processing: Diffusion I
Chapter 7
Lecture
10
Hot processing: Diffusion II
Chapter 7
Lecture
11
Ion implantation I
Chapter 8
Lecture
12
Ion implantation II
Chapter 8
Quiz 2
Lecture
13
Thin films I
Chapter 9
Lecture
14
Thin films II
Chapter 9
Lecture
15
Isolation, contacts, and
metallization
Chapter 11
Lecture
16
Process integration, MEMS
process
Final Exam
18.
教材及其它参考资料 Textbook and Supplementary Readings
4
指定教材: James D. Plummer, Michael Deal, Peter D. Griffin, Silicon VLSI Technology, 2
th
Ed. Prentice Hall, 2008.
推荐参考资料: Stephen A. Campbell, Fabrication Engineering at the Micro- and Nanoscale,4
rd
Ed. Oxford University
Press, 2012
MIT OpenCourseWare: MIT 6.152J - Micro/Nano Processing Technology
课程评估 ASSESSMENT
19.
评估形式
Type of
Assessment
评估时间
Time
占考试总成绩百分比
% of final
score
违纪处罚
Penalty
备注
Notes
出勤 Attendance
课堂表现
Class
Performance
20
小测验
Quiz
10
课程项目 Projects
30
平时作业
Assignments
5
期中考试
Mid-Term Test
10
期末考试
Final Exam
10
期末报告
Final
Presentation
15
其它（可根据需要
改写以上评估方
式）
Others (The
above may be
modified as
necessary)
20.
记分方式 GRADING SYSTEM
A. 十三级等级制 Letter Grading
B. 二级记分制（通过/不通过） Pass/Fail Grading
课程审批 REVIEW AND APPROVAL
21.
本课程设置已经过以下责任人/委员会审议通过
This Course has been approved by the following person or committee of authority
